ELECTROCHEMICAL DEVICE WITH TERMINALS

摘要

PROBLEM TO BE SOLVED: To provide an electrochemical device with terminals which is capable of giving high connection reliability to a solder joint part and in which displacement less likely to occur at solder reflow although a mounting area is small.

SOLUTION: An electrochemical device 11 with terminals comprises: a circular-shaped electrochemical device 12; a first tab terminal 21 having a first plating part 22 at an end; and a second tab terminal 31 having a second plating part 32 at an end. The first plating part 22 and the second plating part 32 are positioned on the same plane. The first tab terminal 21 and the second tab terminal 31 are disposed in a region of a virtual rectangle 41 which circumscribes the electrochemical device 11. The second plating part 32 is disposed in one corner C1 in the region. The first plating part 22 is disposed at least in one of other three corners C2 to C4. A ratio of the area of the first plating part 22 to the area of the second plating part 32 is greater than or equal to 1.5 and less than or equal to 3.0.

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