| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce pickup failure and to prevent peeling of an adhesive agent layer from a heat-shrinkable film by lowering the adhesive strength of a chip and the adhesive layer sufficiently, in an adhesive sheet for producing a chip body consisting of the adhesive layer, the heat-shrinkable film, the adhesive agent layer, and a non-shrinkable film laminated in this order. <P>SOLUTION: The adhesive sheet for producing a chip body consists of an adhesive layer, a heat-shrinkable film, an adhesive agent layer, and a non-shrinkable film laminated in this order. The glass-transition temperature of the adhesive agent layer is 0°C or higher, the storage modulus when measured at 110°C and 11 Hz is 0.5 MPa or higher, and the adhesive force for PET is 2000 mN/25 mm or higher. <P>COPYRIGHT: (C)2013,JPO&INPIT |
