发明名称 |
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE TRANSPORTATION METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To reduce lead time and increase throughput. <P>SOLUTION: A substrate processing device comprises: a substrate container shelf configured to store a substrate container which includes an openable and closable cap and in which a plurality of substrates can be contained; a plurality of substrate loading ports configured to let the substrate enter the substrate container and exit from the substrate container and arranged in a vertical direction; a substrate container transportation device configured to transport the substrate container at least between the substrate container shelf and the plurality of substrate loading ports; an opening/closing device 20 configured to individually move the cap when the cap of the substrate container mounted on the substrate loading port is opened and closed, and provided in each of the substrate loading ports; and a control module configured to control the substrate container transportation device and the opening/closing device 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012199584(A) |
申请公布日期 |
2012.10.18 |
申请号 |
JP20120130845 |
申请日期 |
2012.06.08 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
NAKAJIMA TAKAYOSHI;MATSUNAGA TATSUHISA;YANAGAWA HIDEHIRO |
分类号 |
H01L21/677;B65G49/07;H01L21/31 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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