发明名称 Double-Trench Vertical Devices and Methods with Self-Alignment Between Gate and Body Contact
摘要 Methods and resulting device structures for power trench transistor fabrication, wherein a reachup pillar from the field plate trench is left in place to define the location of a self-aligned contact to the field plate.
申请公布号 US2012261746(A1) 申请公布日期 2012.10.18
申请号 US201213418615 申请日期 2012.03.13
申请人 MAXPOWER SEMICONDUCTOR, INC. 发明人 DARWISH MOHAMED N.;JUN ZENG;BLANCHARD RICHARD A.
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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