| 摘要 |
An organic light emitting diode (OLED) lighting apparatus is disclosed. In one embodiment, the apparatus includes i) a substrate main body including a light emitting area and a sealing area surrounding the light emitting area, ii) an OLED disposed on the light emitting area of the substrate main body, iii) a sealant disposed on the sealing area of the substrate main body and iv) an encapsulation substrate encapsulating the OLED, wherein the encapsulation substrate comprises first and second surfaces opposing each other. The apparatus may further include a heat dissipating wire configured to dissipate heat generated by the OLED. The heat dissipating wire includes a heat absorption portion disposed on the first surface of the encapsulation substrate and contacting the sealant, a heat dissipating portion disposed on the second surface, and a coupling portion interconnecting the absorption portion and the heat dissipating portion. |
