| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin-molded substrate having a plurality of bare chips sealed with a resin material, and to provide a resin-molded substrate. <P>SOLUTION: The method of the present invention for manufacturing a resin-molded substrate, by which a resin-molded substrate having bare chips sealed with a resin material is manufactured, comprises: a frame forming step of forming a frame surrounding the periphery of one or more bare chips by using a first resin material; and a sealing step of filling the inside of the frame in which the bare chips are disposed with a second resin material to seal the bare chips. <P>COPYRIGHT: (C)2013,JPO&INPIT |
