| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly-reliable die bonder capable of surely peeling a die from a wafer even if the die size is larger than a maximum irradiation area of ultraviolet light irradiation means, or to provide a highly-reliable semiconductor manufacturing method using the die bonder. <P>SOLUTION: A semiconductor manufacturing method includes: a peeling step of vacuum-adsorbing a die by adsorption means provided with a bonding head at its tip to peel the die from a wafer; a mounting step of bonding the peeled die to a substrate; an irradiation step of irradiating a prescribed irradiation region of an adhesive tape for dicing containing a gas generating agent generating gas when irradiated with ultraviolet light and adhesively holding the die with the ultraviolet light from an irradiation part; and a movement step of relatively moving the adhesive tape for dicing and the irradiation part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
