| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can relax stress which occurs in a functional section caused by a difference in the linear expansion coefficient between a semiconductor substrate and a mounting substrate. <P>SOLUTION: The semiconductor device 1 includes: the semiconductor substrate 10 in which a flexural part 13 is formed at the central part, which is thinner than the peripheral part; a circuit which is formed in the flexural part 13 on one side of the semiconductor device 10; an external connection electrode 17 which is provided on the other side of the semiconductor device 10; a through-hole wire 18 which passes through the semiconductor device 10 in the thickness direction for connecting the circuit and the external connection electrode 17; and a connecting part 43 which is provided on the one side of the semiconductor device 10 for connecting the through-hole wire 18 and the circuit. The semiconductor device further includes a first groove 31 which is formed nearer to the center of the semiconductor device 10 than the through-hole wire 18 on the other side of the semiconductor device 10 and a second groove 32 which is formed nearer to the periphery of the semiconductor device 10 than the through-hole wire 18 on the one side of the semiconductor device 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
