METHOD FOR PROCESSING INNER PERIPHERY OF BRITTLE MATERIAL SUBSTRATE

摘要

PURPOSE: An inner circumference processing method of brittle material substrates is provided to divide the central zone by cooling the central zone after pressing the central zone. CONSTITUTION: An inner circumference processing method of brittle material substrates comprises the following steps: forming scribing lines(C1) of the inner circumference on a first surface of the brittle material substrate by using scribing wheels having inclined grooves; pressing the central zone while supporting the substrate with a plate(42) which forms holes(49); and separating the central zone by cooling and shrinking the central zone as pressing the central zone. The inclined grooves of the scribing wheel are formed at blade edge of the scribing wheel periodically and with a slope from the axis direction of the scribing wheel. The holes of the plate are not in contact with the central zone which is placed inner side than inner edge lines.