AN ADHESIVE FILM FOR ORGANIC EL DEVICE, A COMPOSITION FOR THE SAME, AND ORGANIC EL DEVICE COMPRISING THE SAME

摘要

PURPOSE: An adhesive film for organic EL devices, a composition included in the same, and an organic el device including the same capable of enhancing tensile strength are provided to enhance impact resistance and usability of the film. CONSTITUTION: An adhesive film for organic EL devices includes an organic resin particles and has the tensile strength of 20-60 N/mm^2 for the film thickness of 10-50 microns after curing the film at 100 deg. Celsius for 2 hours. A resin composition for sealing the organic EL device comprises a low-molecular-weight epoxy resin having the average molecular weight of 50-5,000 g/mol, a high molecular weight epoxy resin having the average molecular weight of 10,000-500,000 g/mol, an organic resin particle, and a hardener.