| 摘要 |
Provided are a metal tape material improved in characteristics to be low in Young's modulus, low in yield stress and high in break elongation and a metal tape material for semiconductor packaging, such as a current-collection interconnector, comprising the same. The metal tape material comprises a metal having face centered cubic lattice structure, in which metal tape material an area fraction A 1 of a preferentially <100> oriented region in which crystal axes <100> of a unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to a thickness direction of the metal tape material and further within an orientation difference of 15° relative to a first in-plane direction of the metal tape material is 60% or greater and not greater than 100%, and, where an area fraction of a preferentially <212> oriented region in which crystal axes <212> of the unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to the thickness direction of the metal tape material and further within an orientation difference of 15° relative to the first in-plane direction of the metal tape material is defined as A 2 , the total of the area fraction of the preferentially <212> oriented region and the area fraction of the preferentially <100> oriented region, A 1 + A 2 , is greater than 70% and not greater than 100%. |
