发明名称 POLYCARBOXYLIC ACID RESIN AND COMPOSITION THEREOF
摘要 <p>A polycarboxylic acid composition containing a polycarboxylic acid resin having a siloxane structure of exceptional heat stability and an organic backbone imparting a cured product with exceptional strength. The polycarboxylic acid composition provides a resin composition that is useful for electrical and electronic materials, molding materials, casting materials, laminate materials, coatings, adhesives, resists, and a broad range of other applications; and, in particular, is extremely useful as a material where optical properties and properties of close adhesion to machinery are required; e.g., adhesives and sealing materials for optical semiconductors (LED products and the like). This polycarboxylic acid composition contains an epoxy resin and a polycarboxylic acid resin having a siloxane structure and an organic backbone.</p>
申请公布号 WO2012137837(A1) 申请公布日期 2012.10.11
申请号 WO2012JP59239 申请日期 2012.04.04
申请人 NIPPONKAYAKU KABUSHIKIKAISHA;MIYAGAWA NAOFUSA;SASAKI CHIE;KUBOKI KENICHI;KAWADA YOSHIHIRO 发明人 MIYAGAWA NAOFUSA;SASAKI CHIE;KUBOKI KENICHI;KAWADA YOSHIHIRO
分类号 C08G63/695;C08G59/42;C08G77/38;H01L33/56 主分类号 C08G63/695
代理机构 代理人
主权项
地址
您可能感兴趣的专利