| 摘要 |
<p>The present invention relates to a microchannel chip capable of preventing fluid leakage caused by a lamination defect. Bottomed first regions (23a', 23b'), second regions (24a', 24b'), and third regions (25a', 25b') are formed by joining a film (14) to a lower surface (21) of the chip main body (12) of a microchannel chip (10). The third regions (25a', 25b') are in communication with the second regions (24a', 24b') and are formed on carbon inks (16a, 16b). The third regions (25a', 25b') are formed wider than the carbon inks (16a, 16b) are. The third regions (25a', 25b') are filled with an electroconductive adhesive.</p> |
