发明名称 RESIN BOND GRINDING WHEEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin bond grinding wheel capable of enhancing productivity by heightening cutting speed while satisfactorily securing working quality. <P>SOLUTION: The resin bond grinding wheel 1 includes: a base material 2 comprising a circular thin plate-shaped resin bond phase; abrasive grains dispersed in the base material 2; and a cutting edge 3 formed at an outer peripheral edge of the base material 2. As the abrasive grains, single body abrasive grains 7 which comprise single abrasive grains, and cohesion abrasive grains 10 in which a plurality of abrasive grains 8 are bonded to one another by a metal phase 9 are included. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012192488(A) 申请公布日期 2012.10.11
申请号 JP20110058145 申请日期 2011.03.16
申请人 MITSUBISHI MATERIALS CORP 发明人 IKEDA YOSHITAKA
分类号 B24D5/12;B24D3/00;B24D3/28 主分类号 B24D5/12
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