MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

In a constitution such that a first mounting substrate on which a semiconductor element is joined and mounted by soldering is mounted on a second substrate, the connection strength is low if the first mounting substrate is joined to the second substrate using solder with a low melting point. This mounting structure has a first mounting substrate (5), to which a semiconductor element (4) is joined by a first solder (1) having a melting point of 217°C or greater, and is mounted on a second substrate (8). Provided are joining parts (6) formed from a plurality that joins the first mounting substrate and the second substrate and reinforcing members (7) formed around each of the various joining parts. The joining parts include a second solder having a melting point lower than the first solder (1) and are constituted so as to have a space (16) between the reinforcing members formed on each of the adjacent joining parts.