| 摘要 |
A process for recycling a support substrate of a material substantially transparent to at least a wavelength of electromagnetic radiation. The process includes providing an initial substrate; forming an intermediate layer on a bonding face of the support substrate having an initial roughness, with the intermediate layer being of a material substantially transparent to at least a wavelength of electromagnetic radiation; forming an electromagnetic radiation absorbing layer either on the bonding face of the initial substrate or on the intermediate layer; bonding the initial substrate to the support substrate via the electromagnetic radiation absorbing layer; and irradiating the electromagnetic radiation absorbing layer through the support substrate and the intermediate layer to induce separation of the support substrate from the initial substrate.
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