| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed wiring board capable of preventing the flexible substrate of an inner layer from bending. <P>SOLUTION: A flexible substrate 1 has a conductive pattern 2 provided on a single-side or double side and is formed in a rectangular shape. A resin sheet 3 with a metal foil is formed by providing a rectangle resin layer 4 in which either a length or a width is shorter than a length or a width of the flexible substrate 1, to a rectangle metal foil 5 having a length or a width being equal to or more than the length and the width of the resin layer 4. The resin layer 4 of the resin sheet 3 with the metal foil overlaps with a surface of the flexible substrate 1 where the conductive pattern 2 is provided thereon such that the flexible substrate 1 protrudes from both ends of at least of the length and the width of the resin layer 4 of the resin sheet 3 with the metal foil. A mold-releasing metal foil 6 having a size being equal to or larger than that of the metal foil 5 is deposited on the both outer sides. A laminated body 7 is sandwiched between two metal plates 8 so as to be heated, pressed and laminate-molded. <P>COPYRIGHT: (C)2013,JPO&INPIT |
