发明名称 COPPER FOIL AND METHOD FOR PRODUCING COPPER FOIL
摘要 Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm2/μF. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.
申请公布号 US2012258281(A1) 申请公布日期 2012.10.11
申请号 US201013518648 申请日期 2010.12.24
申请人 SHINOZAKI KENSAKU;SUZUKI AKITOSHI;TSURUTA TAKAHIRO;FURUKAWA ELECTRIC CO., LTD. 发明人 SHINOZAKI KENSAKU;SUZUKI AKITOSHI;TSURUTA TAKAHIRO
分类号 B32B15/04;B05D5/00;B32B5/00;B32B15/20 主分类号 B32B15/04
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