| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film-like wafer mold material which has excellent transfer performance for a large diameter thin film wafer, exhibits low warpage and good wafer protection performance after molding, and is used suitably in wafer level package. <P>SOLUTION: The film-like wafer mold material for molding a wafer collectively has a multilayer structure consisting at least of a first film layer, and a second film layer on the first film layer. The first film layer contains a silicon skeleton-containing polymer compound, a crosslinking agent, and a filler, and the second film layer contains a silicon skeleton-containing polymer compound, a crosslinking agent, and a filler. When the inclusion rate of filler in the first film layer is 100, the content of filler in the second film layer is more than 0 to less than 100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
