| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Ni-Cu alloy target material for a Cu electrode protective film, which can form a protective film that can be used as a protective film for a Cu electrode, can suppress deterioration in the electrical characteristics caused by electrolytic corrosion and atomic diffusion of the Cu electrode, can achieve patterning at high precision by wet etching, and has satisfactory adhesion with a transparent electrode, and further which can efficiently perform sputtering, and to provide a laminated film produced using the Ni-Cu alloy target material for a Cu electrode protective film. <P>SOLUTION: The Ni-Cu alloy target material for a Cu electrode protective film includes: Cu of 15.0 to 55.0 mass%; (Cr, Ti) of 0.5 to 10.0 mass%; and the balance Ni with inevitable impurities. The laminated film is produced by using the Ni-Cu alloy target material for a Cu electrode protective film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
