| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive tape for processing wafer which is laminated on the wafer surface in order to protect the luminous layer or the circuit surface and to allow for grinding the backside of the wafer to a predetermined finish thickness with no problem, in a process of grinding the backside of a brittle wafer, especially a sapphire wafer. <P>SOLUTION: In the adhesive tape for processing wafer having a radiation curable adhesive layer on a base material resin film, the adhesive force of the adhesive layer in the adhesive tape to the silicon wafer mirror surface is 2.0-35 N/25 mm before radiation curing, and the pure water contact angle of the adhesive layer surface is 85° or more. Compressive displacement in the adhesive tape is preferably 150 μm or less before radiation curing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
