| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having structure capable of removing high frequency noise without using a chip incorporating a plurality of capacitors and without preparing any arrangement space for capacitors on a circuit board. <P>SOLUTION: Capacitor structures 2 are formed and mounted on pads 41 and 42 of a semiconductor chip 1 independently. That is, when the capacitor structure parts 2 are mounted on a plurality of locations on the semiconductor chip 1, a pair for each location, that is, the capacitor structure parts 2 are provided on each location individually. Even when the capacitor structure part 2 having such structure is provided, high frequency noise can be cancelled. In addition, it is not necessary to use a chip incorporating a plurality of capacitors. Further, because the capacitor structure part 2 can be arranged on a necessary location individually, it is not necessary to prepare an arrangement space for the capacitor on a circuit board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
