发明名称 SENSOR MODULE, SENSOR DEVICE, MANUFACTURING METHOD OF SENSOR DEVICE AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor module corresponding to multiple axes and a sensor device comprising the sensor module. <P>SOLUTION: A sensor module 1 comprises a supporting member 10 including three supporting faces 11, 12 and 13 which are orthogonal to one another, three IC chips 20 each of which includes a connecting terminal 22 and an external connecting terminal 23 at a side of an active face 21 and in each of which a side of an inactive face 29 along the active face 21 is mounted to the supporting faces 11, 12 and 13 of the supporting member 10, three vibration gyro elements 30 each including a base portion 31, vibration arms (32a, 32b and the like) extending from the base portion 31 and a connecting electrode 39, and flexible wiring boards 40 and 40a connected with the external connecting terminals 23 of the IC chips 20. Each of the vibration gyro elements 30 is disposed at the side of the active face 21 of each of the IC chips 20, the connecting electrode 39 is mounted to the connecting terminal 22 of each IC chip 20 in such a manner that one principal face 30a is along the supporting faces 11, 12 and 13 and the flexible wiring board 40 includes a reinforcement layer 43. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012193971(A) 申请公布日期 2012.10.11
申请号 JP20110056253 申请日期 2011.03.15
申请人 SEIKO EPSON CORP 发明人 KOYAMA YUGO
分类号 G01C19/56;H01L41/08;H01L41/09;H01L41/18;H01L41/22 主分类号 G01C19/56
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