| 摘要 |
<p>The invention relates to a method for contacting a chip with a conductor arrangement and also to a conductor arrangement, particularly a transponder antenna, an intermediate carrier or the like, with a carrier substrate (55) for accommodating the chip and with a chip having chip terminal faces formed thereon, wherein a conductor material layer (66) is formed on the carrier substrate, wherein the conductor material layer forms a conductor arrangement (64) having at least two conductors (56, 57) which are connected to each other in a chip contact area (58), wherein an insulating gap (59) is formed in the chip contact area, such that mutually electrically insulated conductor terminal faces (60, 61) of the conductors are formed, wherein the chip terminal faces are contacted with the conductor terminal faces, and wherein the insulating gap is formed by removal of the conductor material layer by means of a laser.</p> |
