发明名称 PROCESS CONTROL AND MANUFACTURING METHOD FOR FAN OUT WAFERS
摘要 PURPOSE: A process control method is provided to prevent the loss of processing yield by eliminating uncertainty of location, movement, and slope of an individual die. CONSTITUTION: Images of a first set of dies are obtained(510). The images of the first set are processed in order to detect defects(520). A correction motion is processed to react to the detected defects by processing the images of the first set(530). Images of a second set of the dies are obtained(540). The images of the second set are processed in order to detect defects(550). A correction motion is processed to react to detected defects by processing the images of the second set(560). [Reference numerals] (510) Images of a first set of dies are obtained after finishing a first manufacturing step of a manufacturing process of a fan-out wafer; (520) The images of the first set are processed in order to detect defects; (530) A correction motion is processed to react to the detected defects by processing the images of the first set; (540) Images of a second set of the dies are obtained after finishing a second manufacturing step of the manufacturing process of the fan-out wafer(The second manufacturing process follows the first manufacturing process); (550) The images of the second set are processed in order to detect defects; (560) A correction motion is processed to react to detected defects by processing the images of the second set; (570) Images of a third set of the dies are obtained after finishing a third manufacturing step of the manufacturing process of the fan-out wafer(The third manufacturing process follows the first manufacturing process); (580) The images of the third set are processed in order to detect defects; (590) A correction motion is processed to react to detected defects by processing the images of the third set; (600) Images of a third set of the dies are obtained after finishing a fourth manufacturing step of the manufacturing process of the fan-out wafer(The fourth manufacturing process follows the first manufacturing process); (610) The images of the fourth set are processed in order to detect defects; (620) A correction motion is processed to react to detected defects by processing the images of the fourth set
申请公布号 KR20120111706(A) 申请公布日期 2012.10.10
申请号 KR20110030365 申请日期 2011.04.01
申请人 CAMTEK LTD. 发明人 WEISS TOMMY;LARON NEVO;MOLDERS THOMAS;SHOUKRUN AKI;WERTSMAN NADAV
分类号 H01L21/50;H01L21/66 主分类号 H01L21/50
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