发明名称 |
Embedded component package structure |
摘要 |
The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time. |
申请公布号 |
US8284561(B2) |
申请公布日期 |
2012.10.09 |
申请号 |
US20100850872 |
申请日期 |
2010.08.05 |
申请人 |
SU YUAN-CHANG;HUANG SHIH-FU;APPELT BERND KARL;LEE MING-CHIANG;ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
SU YUAN-CHANG;HUANG SHIH-FU;APPELT BERND KARL;LEE MING-CHIANG |
分类号 |
H05K1/18;H05K1/11 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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