| 摘要 |
PURPOSE: A solder bump coupling within a chip scale package is provided to improve reliability by preventing the generation of cracks of a solder bump. CONSTITUTION: A semiconductor substrate(150) comprises one or more semiconductor devices. An UBM layer(140) is formed on the semiconductor device. A non-conductive layer(130) comprises a cross-section portion which defines a protrusion(132) at the top of a recess within the UBM layer. The protrusion is aligned along interface(142) between the UBM layer and the non-conductive layer. A solder bump(160) is coupled to the UBM layer through an opening(134) within the non-conductive layer. The solder bump comprises a part arranged between the protrusions. |
