发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT
摘要 <p>A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.</p>
申请公布号 KR20120109528(A) 申请公布日期 2012.10.08
申请号 KR20127016708 申请日期 2011.01.18
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. 发明人 KOTANI MASASHI;OOE MASAYUKI;KONNO TAKU;MINEGISHI TOMONORI;ONO KEISHI
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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