| 摘要 |
PURPOSE: A paper wire plate frame for cleaning a semiconductor mold is provided to reduce manufacturing costs by using melamine as a cleaning material. CONSTITUTION: A paper wire plate frame includes a square wire frame structure with a plate type of a foaming and laminating structure and prevents the sticking between a mold surface and the paper wire plate frame by a melamine bar. A top side(100) and a bottom side(120) of the paper wire plate frame prevent the overflow of melamine melt resins. The paper wire plate frame is laminated with a foaming and lamination structure. Coating materials(180) are coated on the top side and the bottom side of the paper wire plate frame to improve heterogeneity. |
