Lower die structure for cutting TAB IC and die for cutting TAB IC,申请号KR20110002549U-传众专利搜索

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发明名称	Lower die structure for cutting TAB IC and die for cutting TAB IC
摘要
申请公布号	KR20120006870(U)	申请公布日期	2012.10.08
申请号	KR20110002549U	申请日期	2011.03.28
申请人		发明人
分类号	B26F1/44;B21D37/00;B26F1/14;B26F1/40	主分类号	B26F1/44
代理机构		代理人
主权项
地址

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