发明名称 POWER MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a power module which reduces its size by avoiding the use of bus bars. <P>SOLUTION: A power module according to this invention has a collector terminal extending from a mold resin to the exterior and an emitter terminal extending from the mold resin to the exterior. At least one of the collector terminal and the emitter terminal includes: a first semiconductor device which extends from opposing two surfaces of the mold resin to the exterior and serves as a both side extending terminal; and a second semiconductor device having the same structure as the first semiconductor device. The both side extending terminal of the first semiconductor device and the both side extending terminal of the second semiconductor device are connected with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012190833(A) 申请公布日期 2012.10.04
申请号 JP20110050472 申请日期 2011.03.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 ARAKI SHINTARO;OKAMOTO YOSHIHIDE;KHALID HASSAN HUSSEIN;AIKO MITSUNORI
分类号 H01L25/10;H01L25/18;H02M7/48 主分类号 H01L25/10
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