MANUFACTURING METHOD OF CONNECTION STRUCTURE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of increasing conduction reliability between electrodes.

SOLUTION: A manufacturing method of a connection structure 1 comprises: a step of disposing an anisotropic conductive material layer which uses an anisotropic conductive material containing a thermosetting component and conductive particles 5 on a first connection target member 2 having an electrode 2b on an upper surface 2a; a step of laminating a second connection target member 4 having an electrode 4b on a lower surface 4a on an upper surface 3a of the anisotropic conductive material layer; and a step of forming a cured material layer 3 by curing the anisotropic conductive material layer on a full scale via heating. A semiconductor chip is used as the second connection target member 4 and a glass substrate is used as the first connection target member 2. A storage elastic modulus G'25at 25°C of the anisotropic conductive material layer before the full-scale curing is set to 1×105Pa or higher and 1×107Pa or lower. The minimum loss elastic modulus G''minwhen the anisotropic conductive material layer before the full-scale curing is heated from 25°C to 250°C is set to 5×102Pa or higher and 1×105Pa or lower.

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