发明名称 |
ELECTRIC CONNECTION METHOD, ELECTRIC CONNECTION STRUCTURE, MANUFACTURING METHOD OF INK JET HEAD, AND INK JET HEAD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric connection method and an electric connection structure which allow variations in height of an electric connection part of a flexible substrate to be absorbed and ensure the electric connection. <P>SOLUTION: This invention relates to an electric connection method for connecting a flexible substrate 60 on which a wiring pattern is formed with an electronic component 48. In an electric connection structure, the flexible substrate 60 is adhered to a support member 62 to be held so that a space 88 is provided on the side of contact parts of the flexible substrate 60 and the electronic component 48. The electric connection method includes: a filling process where a resin material 84 having low viscosity fills the space 88; a semi-cure process where the resin material 84 having the low viscosity is semi-cured; a pressing process where the support member 62 is contacted with the electronic component 48 to be pressed; and a cure process where the resin material 84 is fully cured. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012191050(A) |
申请公布日期 |
2012.10.04 |
申请号 |
JP20110054328 |
申请日期 |
2011.03.11 |
申请人 |
FUJIFILM CORP |
发明人 |
MAEDA YASUHIKO |
分类号 |
H05K3/36;B41J2/045;B41J2/055;B41J2/16;H05K1/14 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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