| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element attachment device, designed to attach two kinds of semiconductor elements to one workpiece, which exhibits higher productivity than before, even when only one kind of semiconductor element is to be attached. <P>SOLUTION: The prevent invention is characterized in that workpieces are locked with a plurality of gathering pallets installed at prescribed intervals and intermittently forwarded on a concave-shaped conveyance path, the gathering pallets being reciprocated at a prescribed pitch determined by the prescribed interval while workpieces are transported, and that up to N pieces (2≤N, N is integer) of the workpieces are supplied to the conveyance path so that they will be locked one at a time by the respective gathering pallets, and the maximum N pieces of the workpieces will have semiconductor elements attached respectively thereto. <P>COPYRIGHT: (C)2013,JPO&INPIT |
