| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent adhesive of a protective tape from adhering to the rear surface of a ground wafer with the protective tape stuck thereto even when the wafer is washed by pre-washing means with a brush part before the wafer is unloaded from a chuck table. <P>SOLUTION: A brush part 100 of the pre-washing means has a smaller diameter than a wafer W, and performs pre-washing so that the brush part 100 does not come into contact with an outer peripheral part W3 of the wafer W and comes into contact with a center of rotation O of the wafer W. This eliminates a fear that even when adhesive of a protective tape T is exposed from the outer peripheral side of the wafer W, the brush part 100 rolls up the adhesive and causes it to adhere to a ground surface W2'. Additionally, a suction surface of a suction pad for unloading the pre-washed wafer W is formed to have the same size as or a smaller size than a region W4 of the wafer W to be pre-washed by the brush part 100. Therefore, even when grinding chips adhere to a region not subjected to the pre-washing, no force is applied to the region during suction, and the wafer is not broken during transportation. <P>COPYRIGHT: (C)2013,JPO&INPIT |
