| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus for a glass substrate by which the treatment time for the split of the glass substrate can be shortened and the generation of wastes has been prevented. <P>SOLUTION: The pulse laser beam 10 of which the wavelength is 300-400 nm is emitted from a laser beam source, and the laser beam 10 is irradiated to the glass substrate 2 by being made into a rectangular (square or rectangle) beam shape. Machined traces 12 are formed on a straight line by irradiating the straight line with the laser beam 10 intermittently by moving an irradiation position against this glass substrate 2 of the laser beam 10 along a planned cutting line. An optical system is made to locate the focal position of the laser beam 10 in the inside of the thickness direction in the glass substrate 2, and the focal depth is set shorter than the thickness of the glass substrate. As a result, the machined traces 12 are formed inside the glass substrate 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
