| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that anisotropic conductive film (ACF) conductive particles move due to ACF binder flow during ACF thermocompression bonding to cause congestion of the conductive particles between bumps when an IC chip is mounted through the chip on glass (COG) method. <P>SOLUTION: A wall like protrusion is formed on a position on a glass substrate which corresponds to the inner side of output bumps of an IC chip. The wall like protrusion prevents movements of conductive particles due to ACF binder flow during the COG mounting and thereby preventing congestion of the conductive particles. <P>COPYRIGHT: (C)2013,JPO&INPIT |
