| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which comes with an electromagnetic shield function and, therefore, can realize size and thickness reduction and cost reduction at the same time. <P>SOLUTION: One or more electronic components 2 are mounted on a circuit board 1 having one or more circuits for semiconductor devices patterned thereon. Further, on ground connecting lands formed on the circuit board 1, a side wall shielding metal component (metal component) 4 is formed so as to enclose the electronic components 2. Thereafter, they are encapsulated with sealing resin (insulating resin) 3 covering top faces of the electronic components 2 and leaving a top edge of the side wall shielding metal component 4 partly exposed as an electrical contact. Then, a shield layer (conductive layer) 5 is formed covering a top face of the sealing resin 3 and connecting to the electrical contact of the side wall shielding metal component 4. Thereafter, the circuit board 1 is cut leaving the side wall shielding metal component 4 intact at both ends, so that semiconductor devices 7a separated into individual pieces, each provided with an electromagnetic shield function, are manufactured. <P>COPYRIGHT: (C)2013,JPO&INPIT |
