发明名称 |
VIA NETWORK STRUCTURES AND METHOD THEREFOR |
摘要 |
A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
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申请公布号 |
US2012248623(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
US201113079579 |
申请日期 |
2011.04.04 |
申请人 |
LI YUAN;NATH SOM NATH;VAN DORT MAARTEN |
发明人 |
LI YUAN;NATH SOM NATH;VAN DORT MAARTEN |
分类号 |
H01L23/48;H01L21/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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