| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a thin wiring board with high mounting density. SOLUTION: The manufacturing method for the wiring board 100 includes a process of alternately laminating insulating layers 11 to 15 and wiring conductors 21 to 24 on the main surface of a support board 1, to form a core lamination 10 composed of the insulating layers 11 to 15 and the wiring conductors 21 to 24; a process of peeling the core lamination 10 off the support board 1; and a process of laminating respective wiring conductors 25 to 28 and insulating layers 16 to 19 alternately on both surfaces of the core lamination 10. In easily peeling the core lamination 10 off the support board 1 without damaging the core lamination 10, the process of forming the core lamination 10 includes a process of interposing a given adhesive between the support board 1 and the core lamination 10, and, preferably, the process of peeling the core lamination 10 of the support board 1 is carried out after the adhesion of the adhesive is lessened or eliminated. COPYRIGHT: (C)2007,JPO&INPIT |
