| 摘要 |
PURPOSE: A chip stacked type semiconductor package is provided to securely form laminate connection between chips by forming a male bump and a female bump on a bonding pad of an upper layer and a lower layer. CONSTITUTION: A male bump(12) is formed on a bonding pad of an upper chip(10). A female bump(22) is formed on a bonding pad of a lower chip(20). The male bump is inserted into the female bump. The male bump is composed of a conductive solder(16) and a copper filler(14) of a predetermined height. The copper filler is formed on the bonding pad of the upper layer by a primary plating process. The conductive solder is formed on the upper side of the copper filler by a secondary plating process. An underfill material is filled between the upper chip and the lower chip. |
