发明名称 |
Bonding pad structure and integrated circuit chip using such bonding pad structure |
摘要 |
An integrated circuit chip includes a substrate; a topmost metal layer over the substrate; a lower metal layer on or over the substrate and lower than the topmost metal layer; and at least one bonding pad in the lower metal layer.
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申请公布号 |
US8278733(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20100729224 |
申请日期 |
2010.03.22 |
申请人 |
MEDIATEK INC. |
发明人 |
YANG MING-TZONG;HUANG YU-HUA |
分类号 |
H01L23/48;H01L23/485 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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