发明名称 |
Manufacturing method of chip package with coplanarity controlling feature |
摘要 |
A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate.
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申请公布号 |
US8278146(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20080330143 |
申请日期 |
2008.12.08 |
申请人 |
LUAN JING-EN;STMICROELECTRONICS ASIA PACIFIC PTE LTD |
发明人 |
LUAN JING-EN |
分类号 |
H01L21/00;H01L23/28;H01L23/48;H01L23/482;H01L25/16 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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