发明名称 Semiconductor structures and methods of manufacturing the same
摘要 A semiconductor structure has embedded stressor material for enhanced transistor performance. The method of forming the semiconductor structure includes etching an undercut in a substrate material under one or more gate structures while protecting an implant with a liner material. The method further includes removing the liner material on a side of the implant and depositing stressor material in the undercut under the one or more gate structures.
申请公布号 US8278164(B2) 申请公布日期 2012.10.02
申请号 US20100700059 申请日期 2010.02.04
申请人 LI XI;ONTALUS VIOREL C.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LI XI;ONTALUS VIOREL C.
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
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