发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 A compound semiconductor device is provided with a first nitride semiconductor layer of a first conductivity type, a second nitride semiconductor layer of the first conductivity type which is formed over the first nitride semiconctor layer and being in contact with the first nitride semiconductor layer, a third nitride semiconductor layer of a second conductivity type being in contact with the second nitride semiconductor layer, a fourth nitride semiconductor layer of the first conductivity type being in contact with the third nitride semiconductor layer, and an insulating film insulating the first nitride semiconductor layer and the fourth nitride, semiconductor layer from each other. A source electrode is positioned inside an Outer edge of the insulating film in planar view.
申请公布号 US2012241758(A1) 申请公布日期 2012.09.27
申请号 US201213493293 申请日期 2012.06.11
申请人 MINOURA YUICHI;KIKKAWA TOSHIHIDE;FUJITSU LIMITED 发明人 MINOURA YUICHI;KIKKAWA TOSHIHIDE
分类号 H01L29/20;H01L21/336 主分类号 H01L29/20
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