INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILLED VIAS AND METHOD OF MANUFACTURE THEREOF

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a via hole in the substrate, the via hole having a top end and a bottom end with the bottom end is larger than the top end; forming a pad on the substrate, the pad encloses the top end of the via hole; and reflowing a conductive filler having higher volume than the via hole over the via hole, the conductive filler having a protrusion extending from the bottom end and the bottom end entirely overlaps at least one surface of the protrusion.