| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aqueous cleaning agent composition for printed-wiring board, which removes the organic rustproof film and copper oxide film formed on a copper electrode surface being a joint face with various electronic components of a printed-wiring board without having adverse effects on the mounted electronic components and their joint portions to obtain a clean copper surface. <P>SOLUTION: The aqueous cleaning agent composition contains (A) a glycol ether-based compound, (B) a nonionic surfactant represented by the formula and (C) organic acids (wherein R<SP POS="POST">4</SP>is 6-20C linear or branched alkyl, phenyl or phenyl replaced with 7-12C linear or branched alkyl; R<SP POS="POST">5</SP>is hydrogen or methyl; and m is an integer of 2 to 20). <P>COPYRIGHT: (C)2012,JPO&INPIT |
