| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for cooling an electronic apparatus casing with high cooling efficiency in which heat can be efficiently discharged from a radiator by concentrically exposing the radiator to the air as a coolant. <P>SOLUTION: A cooling fin 3a is provided on the casing surface of a module 3, a cooling fin 3b is provided on the casing surface confronting it, the module 3 is fixed to the inner wall 5 of the electronic apparatus casing 1, and projecting parts 11 on the open end side of the cooling fin 3a are brought into contact with the inner wall 5 of the electronic apparatus casing 1 to form a coolant passage 6a. A cooling fin 7a is provided on the casing surface of a module 7, a cooling fin 7b is provided on the casing surface facing it, the module 7 is fixed to the inner wall 8 of the electronic apparatus casing 1 which confronts the inner wall 5 of the electronic apparatus casing 1, and projecting parts 12 on the open end side of the cooling fin 7a are brought into contact with the inner wall 8 of the electronic apparatus casing 1 to form a coolant passage 6b. A coolant passage 6c is formed so as to be conformity with the directions of the cooling passages 6a, 6b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
