| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of obtaining a small imaging device having a wiring board arranged between components such as an imaging element chip and the like and a wiring cable. <P>SOLUTION: A wiring board 10 has a plurality of wiring layers 22 and a plurality of insulating layers 23, and is a multilayer substrate incorporating an electronic component 21. The wiring board 10 has an electrode member 20 having an exposed part 20S on vertical lateral faces 13 and 14 that intersect with the plurality of wiring layers 22 and the plurality of insulating layers 23, and being incorporated in a state that a plating film is formed on its surface, and being made of a conductive material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
