| 摘要 |
<P>PROBLEM TO BE SOLVED: To inspect the joining quality of substrates and smoothly conduct processing after joining the substrates. <P>SOLUTION: An upper wafer and a lower wafer are joined (STEP S1 to S13). After a lower chuck is positioned in a predetermined position, vacuum drawing is conducted to the upper wafer in an upper chuck, and the adequacy of the joining quality of the upper wafer and the lower wafer is determined based on an internal pressure of a suction tube (STEP S14). Subsequently, when it is determined that the joining quality is normal in the STEP 14, after the lower chuck is positioned in the predetermined position, the vacuum drawing is conducted to the upper wafer in the upper chuck, and the adequacy of the joining strength of the upper wafer and the lower wafer is determined based on the internal pressure of the suction tube (STEP S15). In the STEP 14 and the STEP 15, when the internal pressure of the suction tube is larger than a predetermined threshold value, it is determined that the joining quality and the joining strength are normal. When the internal pressure of the suction tube is equal to or smaller than the predetermined threshold value, it is determined that the joining quality and the joining strength are abnormal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
